3D V-Cache was a gaming party trick. AMD just crashed into the workstation segment with six new Ryzen PRO 9000 chips, two with X3D stacking, the flagship hitting 128MB of L3 cache at 170W. The Latest ...
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This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...
MediaTek unveiled the Dimensity 9400 chip in October 2024. Speculations are rife that the Taiwanese chipmaker is now working on the Dimensity 9500, which may debut in the last quarter of this year. A ...
NVIDIA’s chip roadmap progresses from the B200, part of the Blackwell architecture, to the Rubin architecture, with hints of potential “ultra” chips or new architectures in the future. The next ...
BBCube™: Bumpless Build Cube. A bumpless three-dimensional semiconductor integrating technology can address the challenges posed by traditional system-in-package (SiP) approaches. A novel power ...
Researchers developed a dual-modulated vertical transistor that suppresses leakage at nanoscale channels and supports scalable 3D semiconductor integration. (Nanowerk News) Researchers at the Daegu ...
Amazon Web Services Inc. will make Cerebras Systems Inc.’s WSE-3 artificial intelligence chip available to its customers. The companies announced the initiative today. It’s part of a multiyear ...
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