A Q&A session on how to deal with the phenomenon of tin whisker growth. The tin whisker phenomenon is a failure mode associated with all electronic devices that use a number of low melting-point ...
Sn(II)-Pyrophosphate Complex with Low Plating/Stripping Potential for Sn–I Flow Battery Applications
The Nature Index 2024 Research Leaders — previously known as Annual Tables — reveal the leading institutions and countries/territories in the natural and health sciences, according to their output in ...
Meco Equipment Engineers, a subsidiary of BE Semiconductor Industries provides its Cell Plating Line (CPL) for a wide variety of next-generation solar cell architectures migrating from silver to ...
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Fundamental materials properties of the plated layer (such as purity and microstructure) are critical for die attach and wirebond, and the specific plating strategies that can yield these properties.
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