TL;DR: Apple has ordered next-gen M5 chips from TSMC for iPad Pro and Macs, with production in 2H 2025. The M5 chips will use TSMC's 3nm process and SoIC technology for better thermal management, with ...

TL;DR: Apple is collaborating with TSMC to adopt advanced WMCM and SoIC packaging technologies for its next-generation A20 and server chips in 2026. These innovations enable ultra-dense chip stacking, ...

TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated WSE (wafer-scale ...

TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip ...

TSMC has reportedly secured four major clients for its latest SoIC packaging – AMD, Nvidia, Broadcom, and Apple. The chip manufacturer is actively working on increasing its next-generation chip ...

Next-generation automotive and power applications will benefit from a fully qualified family of high-reliability small-outline IC (SOIC) packages. The narrow-body packages provide zero delamination ...

Amid scrutiny over Washington’s 10% stake in Intel, TSMC is pressing ahead with its U.S. expansion. MoneyDJ reports that site prep is underway for its two advanced packaging plants (AP1, AP2) in ...