(Yicai) Jan. 13 -- Forehope Electronic said the Chinese integrated circuit packaging and testing services provider plans to ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

SK Hynix Inc, a key supplier to Nvidia and one of the worlds largest memory chipmakers, announced plans to invest 19 trillion ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...

TSMC leads AI chip manufacturing with record 2024 results and 2nm/CoWoS growth. See why I rate the TSM stock a Buy.

In recent days, Amkor Technology has drawn attention as analysts highlighted its role in supplying advanced semiconductor packaging and test services for fast-growing AI-focused chips, including CPUs, ...

Samsung Electronics (OTC:SSNLF) earmarked 25 billion yen ($170 million) to establish an advanced chip packaging R&D center in Yokohama, Japan, intensifying its competition with Taiwan Semiconductor ...

Companies and governments invested heavily in onshoring fabs and facilities over the past 12 months as tariffs threatened to ...

3D packaging is rapidly transforming the semiconductor industry. 3D semiconductor packaging is a sophisticated packaging alternative for semiconductor chips that involve staking of atleast two or more ...

Party General Secretary To Lam and Prime Minister Pham Minh Chinh on January 16 attended the ground-breaking ceremony of ...

Taiwan Semiconductor has also committed to building two facilities that make semiconductor packaging chips, which provide ...