Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...
Electron-beam inspection is proving to be indispensable for finding critical defects at sub-5nm dimensions. The challenge now is how to speed up the process to make it economically palatable to fabs.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results