A new technical paper titled “A Three-Channel Package-Scale Galvanic Isolation Interface for Wide Bandgap Gate Drivers” was published by STMicroelectronics and DIEEI, Università di Catania. “This ...
Sunnyvale, Calif.-based Actel Corp. today released a new type of chip-scale package for its eX family of field programmable gate arrays (FPGAs) use in portable devices. According to Actel, the package ...
Microchip has developed a single-I/O bus UNI/O EEPROM devices in miniature, wafer-level chip-scale and TO-92 packages, in addition to the 3-pin SOT-23 package. Measuring 0.85 mm x 1.38 mm, the ...
The best-performing and most cost-effective power MOSFETs might well turn out to be those having no package at all. With power-MOSFET silicon now largely optimized, manufacturers are quickly ...
The climate crisis continues to be just that… a crisis. And it’s spurring people across the country (and globe) to take action, particularly when it comes to their own lifestyle. Lauren Singer is one ...
Major milestone achieved with completion of commercial-scale process design package ・Standardised design basis supports ...
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