In this interview, AZoM talks to Bas Derksema about advancements in plasma etching and deposition processes for compound semiconductor materials applications. Please could you introduce yourself and ...

Mass spectrometry, by contrast, is a powerful technique for the analysis of any process gas. Careful consideration of differences in pressure, reaction time scales and process flow is essential for ...

A large-scale (4-inch), highly uniform, and defect-free plasma etching technology, which will likely become the foundation of the industrial supply of molybdenum disulfide (MoS₂), a next-generation ...

MUNICH, Germany — Asyntis GmbH, a two-year old supplier of plasma etch equipment for semiconductor manufacturing, has raised 4 million euro (about $4.35 million) in a second round of financing that ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

Tegal Corp. has received an order from an unnamed RFIC maker for its 903 diode plasma etch tool, scheduled for delivery later this year. Tegal (nasdaq: TGL), based in Petaluma, Calif., said the tool ...

The PE-100 Convertible plasma system incorporates reactive ion etching and isotropic etching/cleaning technologies into a stand-alone benchtop system. The all aluminum chamber has over 240 in. 2 of ...

A surprising ultrathin material is challenging long-standing limits in chip fabrication, hinting at a new way to shape nanoscale circuits with greater precision and resilience.

The manufacture of semiconductors has attracted a lot of interest of late, especially because the U.S. produces such a small global share of the most advanced chips. Dutch company ASML’s standout ...

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation ...

Plasma resistant coatings are advanced protective layers engineered to withstand the aggressive conditions encountered in plasma processing, especially within semiconductor manufacturing. These ...