Nasdaq

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Nasdaq

ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems

FREMONT, Calif., May 06, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Yahoo Finance

ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool

FREMONT, Calif., Aug. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Seeking Alpha

ACM Research Unveils Ultra ECDP Electrochemical Deplating Tool for Compound Semiconductor Gold Etch Processes

FREMONT, Calif., Sept. 17, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACMR) (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced ...
Semiconductor Engineering

Electroplating IC Packages

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
EDN

ACM Research Shanghai Launches Single-Wafer Megasonic Cleaning Tool

Semiconductor Equipment startup ACM Research Shanghai, Ltd., today unveiled at SEMICON China the Ultra C™ 12-inch, single-wafer megasonic cleaning tool for advanced cleans at the 65 nm and below ...
Business Wire

Mycropore Receives Repeat Orders from TSMC and UMC for Electro-Copper-Plating Filtration Solutions

HSINCHU, Taiwan--(BUSINESS WIRE)--Mycropore Corporation Ltd., a leading Taiwan-based supplier of micro-contamination control and filtration solution provider for advanced semiconductor industry, today ...
EDN

Applied Reveals Next Generation Plating Tool

Applied Materials Inc. introduced its 300mm SlimCell electrochemical plating (ECP) system today, likening its technology over that of standard ECP to that of single wafer processing vs. batch ...
Business Wire

The New Stratus 200 and Stratus 300 Provides Highest Throughput Electrodeposition System with Maximum Wafer Yield

BILLERICA, Mass.--(BUSINESS WIRE)--July 10, 2006--NEXX Systems, a leading provider of processing equipment for advanced wafer level packaging applications, is pleased to introduce the Stratus 200 and ...
AZoNano

Forge Nano Expands Semiconductor Business; Unveils New 200mm Wafer Atomic Layer Deposition Cluster Tool Ahead of SEMICON West

Forge Nano, Inc., a leading ALD equipment provider and materials science company, today further expanded into the semiconductor market with the unveiling of its new Atomic Layer Deposition (ALD) ...
Semiconductor Engineering

Catching Critical Defects In TSVs And Stacked Chips

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...